TechVibes Episode 12: C7 XCS – BGA Inspection with 7.8 µm in X at 5 GBit/s

Ready for mindblowing semiconductor precision?
The new C7 XCS tracks details ten times thinner than
a human hair without dropping a single frame!

While it’s a seamless new complement to our trusted XCS series, the performance
is next-level. We’re talking about an ultra-high lateral X-resolution of 7.8 microns
that makes the tiniest details visible in width at 3K resolution.
It’s built for advanced packaging, mastering BGA inspections and
coplanarity checks on micro-bumps instantly.

Check these impressive specs:

• Ultra thin laser line, 405nm, 3R
• Z-Resolution: Extreme 0.13 microns
• A X-FOV of 24 mm and a  Z-FOV of 6 mm

Old data bottlenecks? Completely gone. It catches those ultra-fine details
and slams that massive payload of data
down the pipe smoothly at a blazing 5 GBit/s.
Incredible!

Ten times thinner than a hair is the size of a red blood cell.
Welcome to the future of inspection . Time to upgrade!