“The electronics and semiconductor industry is characterized by ongoing miniaturization, increasing component density and ever faster throughput. At the same time, the demand for seamless quality control from inspection and metrology across the entire production process is growing, from PCB manufacturing through placement and bonding processes to final inspection of complex assemblies and electronics packaging. Conventional inspection measurement methods quickly reach their physical and process related limits.
3D laser profile sensors enable highly precise, contactless inline measurement with which height profiles, geometries and positional data of even the finest structures can be captured reliably. Sensor solutions from AT Sensors are designed specifically for the requirements of highly dynamic electronics and semiconductor systems and deliver stable measurement results independent of material properties, reflectivity behavior or ambient light.
Typical applications include height and planarity inspection of printed circuit boards, inspection of solder joints, bonds and contact surfaces, geometry inspection of wafers, chips and substrates, and position and alignment control in placement and assembly processes. High profile rates and precise height resolution allow fast cycling lines to be monitored without interrupting the process.
The result is reproducible, operator independent quality control with robust measurement data in real time. Scrap and rework are reduced, processes are optimized and quality requirements are met reliably, a key prerequisite for the economical industrial scale manufacture of electronic and semiconductor based products.”
