Precise BGA Inspection in the Electronics Industry
The inspection of Ball Grid Arrays (BGA) is a critical quality control measure in the electronics industry. AT – Automation Technology has developed the C6-3070CS 3D profile sensor specifically for this task.
BGA inspection requires extremely accurate and fast sensors to quickly detect even the smallest deviations and defects. Furthermore, detailed evaluation of the 3D point cloud is essential for comprehensive quality assurance.
The C6-3070CS 3D profile sensor from AT offers the world’s fastest 3D sensor technology in terms of resolution and speed. Its on-chip processing enables direct data processing on the sensor, leading to faster result output. Unique features such as MultiPart and MultiPeak enable detailed evaluation of the 3D point cloud, ensuring even more precise BGA inspection.