Demo of a high detailed PGA inspection with our XCS Series

In summary, the XCS sensor offers the following advantages:

Unique 3D scan results without occlusion due to dual-head option and extremely high resolution

High precision and detection of the smallest surface details thanks to high-quality laser line projection

Unrivaled resolution for electronics inspection (e.g. BGA inspection) with a field of view of up to 2.08 in (53 mm)

Highest inspection speed possible with the 3070 WARP sensor variant.