XCS Series High-Precision 3D Laser Profile Sensor for High-Speed Measurement
- Unique 3D scan results without occlusion due to dual-head option and extremely high resolution
- 3D laser profile sensor with high precision and repeatability thanks to high-quality laser line projection
- Unrivaled optical resolution for electronic inspection (e.g. BGA inspection) with a field of view of up to 53 mm
- Highest inspection speed available with 3070 WARP sensor
C6 XCS 3070 (1 Gbit/s)
High-Precision 3D Laser Profile Sensors for the Electronics Industry
With the 3D laser profile sensor from the XCS series, AT Sensors offers a product that is particularly suitable for high-performance applications in the electronics industry thanks to its enormous precision and extreme speed.
The 3D laser profile sensor is characterized by an optimized laser with homogeneous thickness along the laser line, which guarantees precise detection of even the smallest structures.
This enables high-precision inspection applications with high repeatability, which is ideal for the inspection of ball grid arrays (BGAs), among other things. The innovative clean beam function protects the laser from external interference and ensures a uniform intensity distribution, which further increases reliability. The sensor’s dual-head option eliminates occlusions and achieves profile speeds of up to 140 kHz with the 3070 WARP version, speeding up data analysis and increasing efficiency.
Application Recommendation
- Electronics & Semicon
- eMobility & Battery
- Automotive Metrology
- Industrial Automation
- Welding
- Pharmaceuticals
- Wood & Lumber
C7 XCS 3070 (5 Gbit/s)
Ultra-High Resolution 3D Laser Profile Sensors for Advanced Electronics Inspection
With the new C7 XCS 3070, AT Sensors expands the XCS series with its first compact 3D laser profile sensor featuring a 5 Gbit/s interface.
The newly developed model is designed for demanding high-resolution inspection tasks where extremely fine structures need to be captured with high precision and speed.
Thanks to its high-precision, ultra-thin 405 nm laser line and an X-resolution of 7.8 µm, the C7 XCS 3070 closes the gap in applications requiring particularly high lateral resolution.
It is especially suitable for electronics, semiconductor and other precision inspection applications where small details, fine edges and minimal height differences must be measured reliably.
The sensor is available as 3070 and 3070 WARP version and combines compact design, high data throughput and excellent measurement performance in a newly developed housing.
Benefits
- 5 Gbit/s high-speed interface
- Ultra-high lateral resolution (7.8 µm)
- High-precision 405 nm laser optics
- Available as 3070 and 3070 WARP version
- Newly developed compact housing
- Designed for advanced electronics and semiconductor inspection
Technical Highlights
- X-field of view: 24 mm
- Z-field of view: 6 mm
- X-resolution: 7.8 µm
- Z-resolution: 0.13 µm
- Laser wavelength: 405 nm
- Laser class: 3R
Application Recommendation
- Inspection of AI Chips
- Coplanarity Check
- BGA Inspection
- Advanced Packaging
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